10.0 x 10.0 x 17.0 mm  BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

Manufacturer Advanced Thermal Solutions
Description 10.0 x 10.0 x 17.0 mm  BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
Manufacturer Part Number ATS010010017-MF-1P
Lifecycle Status ACTIVE
Length (mm) 10.0
Width (mm) 10.0
Height (mm) 17.0
Fin Tip to Fin Tip (mm) 15.3
TIM N/A
FINISH BLACK-ANODIZED
Thermal Resistance (R,°C/W Unducted Flow) at 200 ft/min. (1,0 m/s) 17.8
Thermal Resistance (R,°C/W Unducted Flow) at 300 ft/min. (1,5 m/s) 14.7
Thermal Resistance (R,°C/W Unducted Flow) at 400 ft/min. (2,0 m/s) 12.9
Thermal Resistance (R,°C/W Unducted Flow) at 500 ft/min. (2,5 m/s) 11.7
Thermal Resistance (R,°C/W Unducted Flow) at 600 ft/min. (3,0 m/s) 10.8
Thermal Resistance (R,°C/W Unducted Flow) at 700 ft/min. (3,5 m/s) 10.0
Thermal Resistance (R,°C/W Unducted Flow) at 800 ft/min. (4,0 m/s) 9.5
Thermal Resistance (R,°C/W Ducted Flow) at 200 ft/min. (1,0 m/s) 14.2
Thermal Resistance (R,°C/W Ducted Flow) at 300 ft/min. (1,5 m/s) 12.1
Thermal Resistance (R,°C/W Ducted Flow) at 400 ft/min. (2,0 m/s) 10.8
Thermal Resistance (R,°C/W Ducted Flow) at 500 ft/min. (2,5 m/s) 9.8
Thermal Resistance (R,°C/W Ducted Flow) at 600 ft/min. (3,0 m/s) 9.1
Thermal Resistance (R,°C/W Ducted Flow) at 700 ft/min. (3,5 m/s) 8.6
Thermal Resistance (R,°C/W Ducted Flow) at 800 ft/min. (4,0 m/s) 8.1
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Product Description

  • Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value
  • Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps costs low
  • Higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks
  • Comes standard without interface material or with most common pressure sensitive thermal tapes as a custom option

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Advanced Thermal Solutions

Advanced Thermal Solutions

Advanced Thermal Solutions, Inc. (ATS) has been in business for more than 25 years as a leading-edge engineering and manufacturing company focused on the thermal management of electronics.

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